Ju Chao Zi Xun·2025-09-24 09:05Group 1 - HBM (High Bandwidth Memory) has become the main driver of growth in the DRAM market, effectively addressing bandwidth bottlenecks, high power consumption, and capacity limitations, making it a mainstream choice for AI chips [1][3] - The global HBM market is projected to grow from $17 billion in 2024 to $98 billion by 2030, with a compound annual growth rate (CAGR) of 33% [3] - The introduction of HBM significantly enhances AI performance and its growth rate surpasses that of traditional memory evolution, effectively breaking the long-standing memory wall limitation [3] Group 2 - The HBM industry chain includes upstream semiconductor raw materials such as plating solutions, precursors, IC substrates, and TSV equipment; midstream involves HBM production; and downstream applications focus on artificial intelligence, data centers, and high-performance computing [3] - The TSV (Through-Silicon Via) process is identified as a major challenge in manufacturing, involving complex processes such as photolithography, coating, and etching, with the highest value [3] - Domestic companies are actively expanding in the HBM industry chain, with Sai Teng Co. gaining recognition for its HBM testing equipment and Zhongwei Company making comprehensive layouts in advanced packaging, including HBM processes [3] Group 3 - Analysts believe that the accelerating breakthrough of domestic HBM will be crucial for enhancing the self-controllable capabilities of the domestic semiconductor industry [3] - The continuous release of demand for AI and high-performance computing is expected to sustain high growth in HBM demand [3]