微软研发微流体冷却系统:实现AI芯片精准降温
Huan Qiu Wang·2025-09-24 10:00

Core Insights - Microsoft has developed a new chip-integrated microfluidic cooling system that significantly improves heat dissipation compared to current cold plate technologies [1][2] - The new cooling system addresses the increasing heat generated by modern AI chips, which is much higher than previous generations, and aims to overcome the limitations of existing cooling technologies [2] Group 1 - The new cooling technology allows coolant to flow directly into the chip, enhancing heat dissipation efficiency [2] - Microsoft utilized AI to identify unique thermal distributions on the chip, enabling more precise guidance of coolant to hotspot areas [2]