Workflow
为应对AI合作巨额开支 甲骨文(ORCL.US)拟发债融资150亿美元
OracleOracle(US:ORCL) 智通财经网·2025-09-24 13:03

Group 1 - Oracle plans to raise $15 billion in the U.S. investment-grade bond market [1] - The bond issuance will consist of up to seven parts, including a rare 40-year bond [1] - The initial pricing discussion for the 40-year bond is set at 1.65 percentage points above the yield of U.S. Treasuries [1] Group 2 - The bond issuance coincides with Oracle's large-scale cloud infrastructure collaborations with OpenAI and Meta, which are increasing operational costs [1] - Oracle is expected to invest several hundred billion dollars in data center leasing and power supply over the coming years [1] - Proceeds from the bond issuance will be used for capital expenditures, future investments or acquisitions, and general corporate purposes, including debt repayment [1] Group 3 - The lead underwriters for the bond issuance include Bank of America, Citigroup, Deutsche Bank, Goldman Sachs, HSBC, and JPMorgan [1] - Oracle's last bond issuance occurred in January of this year [1]