青岛银行股份有限公司 关于2025年科技创新债券发行完毕的公告

Group 1 - The core point of the announcement is that Qingdao Bank has successfully issued the "2025 Technology Innovation Bond" with a total issuance size of RMB 1 billion [1] - The bond was recorded on September 19, 2025, and completed issuance on September 23, 2025, with a fixed interest rate of 1.87% over a 5-year term [1] - The funds raised from this bond will be used to specifically support businesses in the technology innovation sector through various means such as loans and other bonds, in accordance with applicable laws and regulatory approvals [1]