晶盛机电：截至6月末公司未完成集成电路及化合物半导体装备合同超37亿元

Core Viewpoint - The company is benefiting from the continuous development of the semiconductor industry and the acceleration of domestic production processes, with a significant backlog of contracts in semiconductor equipment totaling over 3.7 billion yuan (including tax) as of June 30, 2025 [1] Group 1: Semiconductor Business Development - The company has achieved localization of semiconductor equipment for 8-12 inch large silicon wafer production and is expanding into chip manufacturing and advanced packaging sectors [1] - The company focuses on the research and development of third-generation semiconductor silicon carbide equipment, successfully breaking through multiple core technologies in crystal growth, processing, and epitaxy [1]