ACM Research (ACMR) Launches New Ultra ECDP Electrochemical Deplating Tool

Group 1 - ACM Research, Inc. (NASDAQ:ACMR) has launched its first Ultra ECDP Electrochemical Deplating tool aimed at the wide bandgap compound semiconductor manufacturing market [1][4] - The Ultra ECDP tool is designed for electrochemical wafer-level gold etching, providing benefits such as smaller undercut, enhanced uniformity, and improved gold line appearance [2][3] - The tool features specialized processes for removing Au bumps, etching thin Au films, and deep-hole Au deplating, along with integrated pre-wet and cleaning chambers [3][5] Group 2 - The compound semiconductor market is experiencing growth driven by demand from sectors such as electric vehicles, 5G/6G communication, RF, and AI applications [4] - ACM Research, Inc. develops and sells a range of semiconductor process equipment, including cleaning, electroplating, and wafer-level packaging tools, supporting advanced semiconductor device manufacturing [6]