FOUNDERTECH(SH:600601) Ju Chao Zi Xun·2025-09-26 03:21Core Viewpoint - Fangzheng Technology has revised its plan for a private placement of A-shares to enhance business development and core competitiveness, particularly in the high-end PCB market driven by the growth of the artificial intelligence industry [2][3] Summary by Sections Issuance Plan - The revised plan involves issuing no more than 30% of the total share capital before the issuance, equating to a maximum of 1,282,122,866 shares [3] - The total amount of funds to be raised, including issuance costs, is capped at 198 million yuan [3] Investment Project - The raised funds will be allocated to an artificial intelligence and high-density interconnect (HDI) circuit board industrial base project, with a total investment of approximately 213.11 million yuan [3] - The project aims to enhance Fangzheng Technology's market position in high-end HDI products, catering to the increasing demand from sectors such as artificial intelligence, autonomous driving, and optical modules [3] Implementation Details - The project will be executed by Fangzheng Technology's wholly-owned subsidiaries located in Zhuhai, Guangdong Province, covering an area of about 120 acres [3] - The project is expected to support the development of the PCB industry cluster in Zhuhai, contributing to the company's strategic shift towards high-end and intelligent product offerings [3]