IBR(SZ:300675) Di Yi Cai Jing·2025-09-26 10:31Core Viewpoint - The company has approved a proposal to issue technology innovation bonds with a maximum scale of 250 million yuan, aimed at supporting various technology innovation projects and enhancing overall strategic development [1] Group 1: Bond Issuance Details - The bond issuance scale is not to exceed 250 million yuan, with a term of no more than 5 years [1] - The issuance method will be a non-public offering, with annual interest payments and a lump-sum repayment at maturity [1] Group 2: Use of Proceeds - The raised funds will be utilized for technology innovation project investments, acquisitions or establishment of technology innovation enterprises, construction of research and development platforms, and working capital for daily operations [1] Group 3: Approval Process - The proposal requires approval from the company's second extraordinary general meeting in 2025 and must obtain a no-objection letter from the Shenzhen Stock Exchange before implementation [1]