建科院(300675.SZ)：拟发行科技创新债券

Core Viewpoint - The company, Jian Ke Yuan, has approved a proposal to issue technology innovation bonds with a maximum scale of 250 million yuan, aimed at funding various technology-related projects and operational needs [1] Summary by Categories Bond Issuance - The company plans to issue technology innovation bonds not exceeding 250 million yuan [1] - The approval was made during the tenth temporary meeting of the fourth board of directors [1] Fund Utilization - The raised funds will be used for technology innovation project investments, acquisitions, establishment of technology innovation enterprises, and construction of R&D platforms [1] - Funds may also be allocated for daily operational liquidity needs, in compliance with legal and regulatory requirements [1] - The company retains the right to adjust the usage of funds as necessary, but the funds will not be used for new stock placements, stock trading, or other non-productive expenditures [1]