泰和新材：公司正在开发由POD（聚噁二唑）为基材制备的高性能导热膜材料，目前项目已经进入中试阶段

Core Insights - The company clarified that the previously mentioned mobile heat dissipation film and aramid thermal conductive film are not the same product [2] - The company is currently developing a high-performance thermal conductive film material based on POD (polyoxadiazole), which has broad applications in the thermal management of electronic devices [2] - The project has entered the pilot test stage, indicating progress in the development process [2]