Venture(US:VEMLY) 智通财经网·2025-09-30 13:12Core Viewpoint - Zhuhai Yueya Semiconductor Co., Ltd. has initiated its IPO on the Shenzhen Stock Exchange's ChiNext board, aiming to raise 1.22416 billion yuan, focusing on advanced packaging materials and products [1][2] Company Overview - Yueya Semiconductor specializes in the R&D, production, and sales of advanced packaging materials, including IC packaging substrates and embedded packaging modules, being one of the earliest domestic producers of IC packaging substrates [1] - The company is recognized for its proprietary technology, particularly the "copper pillar bumping method" for mass production of "chipless" IC packaging substrates, and has successfully launched FC-BGA packaging substrates [1] Market Position - The company has established a strong market position due to its rich customer resources and brand image, with over 100 domestic and international clients, including major players like Infineon, Qorvo, Texas Instruments, and leading domestic semiconductor testing companies [1][2] Future Growth Drivers - The ongoing development in sectors such as 5G, artificial intelligence, big data, and cloud computing is expected to drive further growth in the company's performance [2] Fundraising and Investment Projects - The funds raised will be invested in projects closely related to existing business, specifically in embedded packaging modules and IC packaging substrates [2] - The total expected investment for the projects is approximately 127.96 million yuan, with the majority allocated to the AI-focused embedded packaging module expansion project [3] Financial Performance - The company has shown steady revenue growth, with projected revenue of 810.88 million yuan for the first half of 2025 and a net profit recovery expected in 2024 compared to 2023 [4] - Historical revenue figures indicate a consistent upward trend, with 2023 revenue at 1.705 billion yuan and a net profit of 187.88 million yuan [4]