Venture(US:VEMLY) Zheng Quan Shi Bao Wang·2025-10-02 05:48Core Viewpoint - Yuya Semiconductor has initiated its IPO application on the Shenzhen Stock Exchange, aiming to raise 1.224 billion yuan for projects related to AI and operational funding [1] Company Overview - Yuya Semiconductor specializes in the research, production, and sales of advanced packaging materials and products, being one of the earliest domestic companies to produce IC packaging substrates [1] - The company's main products include IC packaging substrates and embedded packaging modules, with applications in RF front-end, high-performance computing, and power management [1][2] Financial Performance - The company's projected revenues from 2022 to the first half of 2025 are 1.667 billion yuan, 1.705 billion yuan, 1.796 billion yuan, and 811.73 million yuan, respectively [2] - Net profits for the same periods are expected to be 415 million yuan, 188 million yuan, 215 million yuan, and 91.47 million yuan [2] Industry Context - The global IC packaging substrate market is dominated by manufacturers from Taiwan, Japan, and South Korea, with the top ten companies holding over 80% market share [2] - Domestic companies, including Yuya Semiconductor, are experiencing growth in sales, but their global market share remains low, indicating significant development potential [2] Technological Position - Yuya Semiconductor's embedded packaging technology is considered advanced, with the company being one of the few globally to achieve mass production of embedded packaging products since 2017 [3] - The company aims to leverage opportunities in AI and communication technology revolutions, focusing on domestic substitution of semiconductor materials and enhancing the localization of mid-to-high-end IC packaging substrates [3]