Core Insights - Synopsys, Inc. is enhancing its role in semiconductor design through an expanded collaboration with Taiwan Semiconductor Manufacturing Company (TSMC) to meet the increasing demand for high-performance AI and system-on-chip (SoC) technologies [1][5] Collaboration with TSMC - Synopsys has certified its digital and analog design flows on TSMC's N2P and A16 processes, utilizing the NanoFlex architecture to optimize chip performance, reduce power consumption, and accelerate time-to-market [2][10] - The IC Validator certification for TSMC A16 improves physical verification, facilitating faster and more reliable design sign-offs [2] - The 3DIC Compiler platform supports advanced 3D stacking and CoWoS packaging technologies, contributing to multiple customer tape-outs and enhancing productivity for complex multi-die designs [3][10] - Synopsys is also collaborating with TSMC on silicon photonics, utilizing AI-optimized photonic flow to address performance and thermal challenges in AI systems [3] Comprehensive IP Portfolio - Synopsys' extensive IP portfolio supports leading standards such as PCIe 7.0, UCIe, HBM4, and 1.6T Ethernet, with dedicated automotive IP for TSMC's N5A and N3A nodes targeting key markets like AI, automotive, and high-performance computing [4] Strategic Partnerships - In addition to TSMC, Synopsys has formed strong partnerships with Intel Corporation and Arm Holdings to advance chip design and innovation [6][9] - The collaboration with Intel focuses on enabling design flows and IP solutions for Intel's latest 18A process node, optimizing performance, power, and area for next-generation processors [7] - Synopsys provides EDA tools and a broad IP portfolio compatible with Arm's CPU, GPU, and AI cores, ensuring quick integration of components and meeting power and performance targets [8][9] Industry Positioning - The strengthened collaboration with TSMC reinforces Synopsys' position as a critical partner in advanced chip development, well-positioned to drive long-term growth in the AI and multi-die era [5]
Synopsys Strengthens AI and Multi-Die Design Through TSMC Partnership