科技创新债券发行加速

Core Insights - The announcement by the People's Bank of China and the China Securities Regulatory Commission on May 7 has led to active participation in the issuance of technology innovation bonds [1] - A total of 530 institutions issued technology innovation bonds amounting to 1,165.847 billion yuan from May 7 to September 28 [1] - Financial institutions issued 319.67 billion yuan, while non-financial enterprises issued 846.177 billion yuan, indicating a significant contribution from non-financial sectors [1] Summary by Category - Market Participation - 530 institutions participated in the issuance of technology innovation bonds [1] - The total issuance reached 1,165.847 billion yuan from May 7 to September 28 [1] - Institutional Breakdown - 88 financial institutions issued bonds totaling 319.67 billion yuan [1] - 442 non-financial enterprises issued bonds amounting to 846.177 billion yuan [1] - Market Structure - Non-financial enterprises issued 403.88 billion yuan in the interbank market and 442.297 billion yuan in exchanges [1] - The establishment of the "technology board" in the bond market aims to enhance financing support for technological innovation and diversify the bond market [1]