精测2025年前三季营收超越去年全年

Core Viewpoint - The company, 精测 (6510), reported strong revenue growth in September and the third quarter, driven by increased orders for next-generation smartphone flagship chips and HPC applications [1] Revenue Performance - September revenue reached NT$4.18 billion, representing a month-over-month increase of 1.1% and a year-over-year increase of 31.8% [1] - Third-quarter consolidated revenue was NT$12.42 billion, showing a quarter-over-quarter increase of 2.2% and a year-over-year increase of 35.5% [1] - Cumulative revenue for the first three quarters amounted to NT$36.1 billion, reflecting a year-over-year growth of 55.9% [1] Key Drivers - The revenue from probe cards accounted for 30% of the third-quarter revenue, which was a key driver of performance [1] - The global semiconductor industry is accelerating towards high-frequency, high-current, and high-density developments, increasing the demand for advanced wafer processing and packaging testing technologies [1] Market Outlook - The company is optimistic about the growth in the market driven by AI advancements, data centers, and GPU applications, which are rapidly increasing computational power demands [1] - As advanced process technologies evolve and process nodes continue to shrink, the number of transistors is expected to increase exponentially, presenting challenges related to high current and high temperature [1] Technological Innovations - The company has developed a heat dissipation technology for lead frames to address the challenges posed by high current and temperature [1] - This comprehensive testing solution not only enhances the mean time between failures for customer products but also significantly shortens the time from design validation to mass production [1]