Workflow
ARM CEO 锐评英特尔:因错失良机而“受罚”,要想追上台积电极其困难
Xin Lang Cai Jing·2025-10-05 20:03

Core Insights - ARM CEO Rene Haas commented on the competitive landscape between Intel and TSMC, stating that Intel has faced "time penalties" due to missed opportunities and that catching up with TSMC is now "very difficult" [1][3]. Group 1: Intel's Key Mistakes - Intel's complete absence in the mobile chip sector has been a significant error, particularly missing the opportunity to supply chips for the iPhone due to the underperformance of its low-power Atom series SoC [3]. - Intel's late investment in Extreme Ultraviolet (EUV) technology has put it behind TSMC, which has been utilizing EUV for advanced chip manufacturing for about a decade [4]. Group 2: Semiconductor Industry Characteristics - The semiconductor industry requires long-term investment and accumulation, with high barriers to entry. Once a company falls behind in chip manufacturing, it becomes extremely challenging to catch up due to the accelerating industry cycle [6]. - TSMC has established a leading position in advanced manufacturing processes, currently providing top-tier wafer fabrication services to major companies like Apple, NVIDIA, and AMD [6]. Group 3: Manufacturing Culture Differences - There is a cultural disparity in manufacturing perceptions between the West and Taiwan, where working at TSMC is seen as prestigious, while in the West, manufacturing is often viewed as a "blue-collar job" [6]. - Establishing advanced manufacturing capabilities in the U.S. requires systemic reforms across multiple industries, along with long-term policy and administrative support [6].