Core Insights - Amkor Technology has initiated the construction of a semiconductor advanced packaging and test campus in Arizona, with a total investment of $7 billion planned over two phases, increasing its commitment by more than $5 billion [1][2] - The facility aims to enhance cleanroom capacity, providing over 750,000 square feet of space, and is expected to be completed by mid-2027, with production starting in early 2028 [1][2] Investment and Development - The expanded investment will focus on creating additional cleanroom space and a second greenfield packaging and test facility [1] - The project is part of a broader initiative to strengthen the semiconductor infrastructure in the US, aligning with the needs of major customers like Apple and Nvidia [3][4] Technological Advancements - The campus will incorporate smart factory technologies and scalable production lines, catering to industries such as AI, computing, mobile communications, and automotive [3] - The new facilities are designed to complement TSMC's wafer manufacturing operations by providing downstream processing for complete semiconductor production [3] Strategic Importance - The project is seen as a significant step in reindustrializing America and rebuilding the supply chain for AI technology, supported by various government initiatives [4] - Amkor's president and CEO emphasized the facility's role in meeting advanced customer needs and shaping the future of semiconductor manufacturing in the US [2][4]
Amkor starts construction on Arizona semiconductor campus