Core Insights - SCHMID Group has expanded its product portfolio to address the increasing demand for advanced packaging substrates and high-performance server boards driven by the AI era [1][14][15] - The semiconductor and advanced packaging sector is projected to grow at a CAGR of around 10% over the next five years, with significant contributions from market leaders like TSMC and NVIDIA [2][15] - The traditional PCB industry is expected to grow at an 8% CAGR, while AI server boards are anticipated to experience a robust growth rate of about 20% [3][15] Company Developments - SCHMID has broadened its InfinityLine product family to enhance its position in next-generation package substrates and AI-server PCBs [4][12] - The company is uniquely positioned to deliver Chip-on-Wafer-on-PCB (CoWoP) solutions, focusing on best-in-class yield and low cost of ownership [5] - SCHMID anticipates that 2025 will be a transition year, with above-market growth expected from 2026 onwards, particularly in AI-driven product lines [6] Product Innovations - The existing InfinityLine H+ remains the top-selling equipment, while the new InfinityLine C+ is on track to become a significant revenue contributor [12] - Upcoming products include InfinityLine L+ for panel-level substrates and InfinityLine P+ for next-generation single panel plating, both set to launch in late 2025 [12] - SCHMID's QuantumLine and SCHMID-AVACO Plasma Equipment are designed to enable high-yield glass core substrate production [12]
SCHMID Group Expands Advanced Packaging Portfolio to Power the AI Era