我国科学家实现全球首颗二维-硅基混合架构芯片，产业落地还有多久

Core Insights - Fudan University has achieved a breakthrough in two-dimensional (2D) semiconductor flash memory, presenting the world's first 2D-silicon-based hybrid architecture chip, addressing key engineering challenges in new 2D information devices [1][3][9] Research Progress - The research on 2D semiconductors is still in its early stages internationally, with significant advancements made since 2018, including the development of a prototype device capable of 400 picoseconds ultra-fast non-volatile storage, marking the fastest semiconductor charge storage technology to date [2][3] - The team has been working on integrating 2D ultra-fast flash memory into existing CMOS technology to accelerate the commercialization process, aiming to overcome the "LAB to FAB" challenge [5][6] Industrialization Strategy - The research team plans to establish an experimental base and collaborate with relevant institutions to lead engineering projects, targeting a chip capacity of one million (Mb) within the next 3 to 5 years [9][10] - The integration of 2D flash memory into the mature CMOS manufacturing process is expected to significantly shorten the time required for commercialization, potentially transforming the semiconductor industry [6][8] Technological Innovation - The team has developed an "Atomic Device to Chip" (ATOM2CHIP) system integration framework, allowing for the modular integration of 2D storage circuits with mature CMOS circuits, facilitating the transition from laboratory results to functional chips [8] - The innovative integration process is seen as a milestone for the engineering of 2D applications, paving the way for new high-speed information technology [8]