国内两家碳化硅相关厂商完成新一轮融资！

Group 1 - Silicon carbide is becoming a core force in driving the development of new energy and industrial control sectors, highlighting its strategic significance and market value [1] - Hanxin Technology completed a new round of financing exceeding 200 million yuan, led by Xi'an High-tech Zone [1] - The financing will enable Hanxin Technology to establish a second headquarters in Xi'an, enhancing collaboration with local enterprises and universities, and accelerating the R&D and industrialization of silicon carbide core products [1][2] Group 2 - Zhongke Guangzhi announced the completion of the first batch of B-round financing, securing several million yuan from the Jin Niu District Jiazi Private Equity Fund Management Co., Ltd [2] - The funds will be used to develop a silicon carbide chip packaging equipment R&D and manufacturing center in Chengdu, focusing on high-precision fully automatic die bonding machines [2][3] - The high-precision fully automatic die bonding machine is a core product of Zhongke Guangzhi, designed for high-precision applications in power semiconductors, optical communications, and LEDs, significantly improving production efficiency and yield [3] Group 3 - Both companies are expected to achieve greater breakthroughs in silicon carbide technology R&D, product innovation, and industrialization, injecting continuous vitality into China's third-generation semiconductor industry [5]