Vertiv Accelerates AI Infrastructure Deployment with OCP-Compliant Power, Cooling, and Rack Ecosystem

Core Insights - Vertiv is set to unveil new rack, power, and cooling technologies at the 2025 OCP Global Summit, emphasizing its commitment to high-density, energy-efficient data center environments aligned with Open Compute Project (OCP) design guidelines [1] Group 1: New Technologies - The Vertiv PowerIT rack power distribution unit (PDU) can deliver up to 57.6 kW of reliable power distribution, featuring advanced management, load balancing, and cybersecurity capabilities for high-density computing environments [2][5] - Vertiv's PowerBar Track is a modular overhead power distribution system designed for high-density AI and HPC applications, optimizing space and simplifying installation while ensuring continuous power delivery [3][6] - The SmartIT OCP rack solution supports loads up to 142 kW and offers prefabricated configurations that combine validated power and cooling options for faster deployment and improved reliability [4] Group 2: Collaboration and Integration - Vertiv's collaboration with Harting focuses on compact, high-performance connectivity solutions that simplify integration and maximize usable rack space for IT equipment [8] - The integration of rack, busway, cabling, and distribution into a single ecosystem aims to provide customers with a faster and more reliable path to deploy AI-ready capacity across their facilities [9] Group 3: Future Innovations - Vertiv will present its vision for future innovation at the summit, highlighting the transformation of early concepts into functional prototypes and the role of modular, scalable designs in creating adaptive and energy-efficient data centers [10][11]