SEMI：今年全球300mm晶圆厂设备支出将首次逾1000亿美元

Core Insights - The global spending on 300mm wafer fab equipment is projected to reach $374 billion from 2026 to 2028, driven by the regionalization trend and surging demand for AI chips in data centers and edge devices [1][2] - The report anticipates that global spending on 300mm wafer fab equipment will exceed $100 billion for the first time in 2025, growing by 7% to $107 billion [1] - Significant investments are expected in Logic and Micro sectors, totaling $175 billion from 2026 to 2028, primarily driven by foundries benefiting from sub-2nm process capacity [1] Investment Projections - In 2026, equipment spending is expected to grow by 9% to $116 billion, followed by a 4% increase in 2027 to $120 billion, and a 15% rise in 2028 to $138 billion [1] - Memory sector is projected to rank second with $136 billion in spending over three years, marking the beginning of a new growth cycle [2] - DRAM-related equipment investment is expected to exceed $79 billion, while 3D NAND investment will reach $56 billion, driven by AI training and inference needs [2] Regional Insights - China is expected to lead global 300mm equipment spending with a total investment of $94 billion from 2026 to 2028, supported by national policies [2] - South Korea is projected to invest $86 billion, ranking second globally, to support the demand for generative AI [2] - The Americas are expected to invest $60 billion, rising to fourth place, as U.S. suppliers expand advanced process capacity [3]