Jing Ji Ri Bao·2025-10-12 23:08Core Insights - The demand for AI and high-performance computing (HPC) remains strong, leading to full capacity utilization for TSMC's advanced packaging in the coming year [1] - Major players like ASE Technology and KYEC are also experiencing significant orders, prompting them to expand production [1] - The generative AI wave initiated by OpenAI is driving explosive growth in HPC orders from companies like NVIDIA and AMD, with demand expected to last at least until the end of next year [1] Group 1 - TSMC is the sole supplier of high-performance computing capacity for NVIDIA and AMD, with its 2nm and 3nm advanced processes and SoIC, CoWoS advanced packaging fully booked [1] - ASE Technology is accelerating its advanced packaging and testing outsourcing to meet the substantial demand from AI clients [1] - ASE's subsidiary, SPIL, is set to complete its new facilities in Erlin and Douliu next year, alongside the acquisition of a facility in Kaohsiung, enhancing its operational capacity [1] Group 2 - KYEC has successfully secured a major testing order from NVIDIA for high-performance computing, with GB200/300 orders currently in mass production [2] - The testing capacity for NVIDIA's upcoming Rubin platform is expected to commence by the end of this year [2]