至纯科技：拟发行不超2亿元短期融资券

Core Viewpoint - The company plans to issue short-term financing bonds not exceeding 200 million yuan to support its operational activities and debt repayment [1] Group 1 - The board of directors will convene on October 15, 2025, to review the proposal for the bond issuance [1] - The bonds will be registered with the China Interbank Market Dealers Association and will have a maturity of no more than 12 months [1] - The specific issuance scale will depend on market conditions and the company's funding needs, with the interest rate determined by market conditions [1] Group 2 - The raised funds will be utilized for production operations, repayment of existing debts, and supplementing working capital [1] - The proposal requires approval from the company's shareholders' meeting and must be authorized by the Dealers Association before implementation [1]