德福科技：公司自主研发的3um超薄载体铜箔、RTF1-3代铜箔、HVLP1-3代铜箔均已批量稳定供货

Core Viewpoint - Defu Technology (301511) has successfully achieved stable mass production of its self-developed 3um ultra-thin carrier copper foil, RTF1-3 generation copper foil, and HVLP1-3 generation copper foil, marking a significant step in domestic substitution for these products [1] Group 1 - The company has developed and is now supplying 3um ultra-thin carrier copper foil [1] - RTF1-3 generation copper foil has also reached stable mass production [1] - HVLP1-3 generation copper foil is being supplied in stable quantities [1]