央行副行长邹澜：科技创新债券融资增量扩面，资金加快流向科创领域

Core Insights - The People's Bank of China has introduced a "Technology Board" in the bond market to support equity investment institutions in financing, which is a key connection between the bond and equity markets [2] - The "Technology Board" has led to significant growth in technology innovation bond financing, with 670 billion yuan issued by approximately 280 entities in the interbank bond market over the past five months [2][3] Group 1 - The structure of technology enterprises is diverse and widely distributed, with 191 technology enterprises issuing 377 billion yuan in technology innovation bonds across 26 provinces [2][3] - Issuers have the flexibility to choose their issuance methods, with nearly half of the technology enterprises issuing bonds with a maturity of three years or more, and equity investment institutions averaging a maturity of 5.8 years [3] - The financing cost is relatively low, with an average coupon rate of about 2% for technology innovation bonds, indicating strong market demand and increased trading activity [3]