SOITEC: SOITEC AND CEA PARTNER TO DEVELOP AUTOMOTIVE CYBERSECURITY WITH ADVANCED FD-SOI TECHNOLOGY

Core Insights - Soitec and CEA are collaborating to enhance automotive cybersecurity through advanced Fully Depleted Silicon-on-Insulator (FD-SOI) technology, addressing the increasing vulnerabilities in modern vehicles as they become more software-defined and connected [1][2]. Technology and Security - FD-SOI substrates provide intrinsic protection against fault injection attacks, which are recognized as a significant risk by automotive cybersecurity standards such as ISO/SAE 21434 [2]. - Fault injection attacks can disrupt a chip's normal operation, allowing hackers to bypass security checks and access protected data [3]. - Laser Fault Injection (LFI) is highlighted as a precise attack method that targets chip vulnerabilities at a sub-micron and sub-nanosecond scale, which can be exploited against vehicles [4]. Research Findings - Research conducted at CEA-Leti laboratories shows that FD-SOI technology requires up to 150 times more effort and higher laser power to induce faults compared to traditional 28-nanometer bulk silicon, thereby increasing the complexity and cost of potential attacks [5]. - The resilience of FD-SOI supports compliance with emerging automotive cybersecurity standards, including the need for a secure "reference chip" for vehicle software encryption codes [6]. Future Innovations - Future developments in substrate technology, such as buried optical barriers and integrated sensors, could further enhance the security capabilities of semiconductor wafers [6]. Company Profiles - Soitec, a leader in innovative semiconductor materials, reported sales of €0.9 billion in the fiscal year 2024-2025 and focuses on three main markets: Mobile Communications, Automotive and Industrial, and Edge and Cloud AI [10]. - CEA is a public research body that aids policymakers and provides scientific tools to address societal changes related to digital and energy transitions, healthcare, and security [9].