Mei Ri Jing Ji Xin Wen·2025-10-20 14:16Core Insights - The three major telecom operators in China have officially launched eSIM mobile services, marking a significant advancement in the eSIM technology for smartphones and creating new growth opportunities for the eSIM industry chain [1] Industry Overview - The global eSIM chip shipment reached 446 million in 2023, covering various products including smartphones and automotive devices. By the end of 2025, the number of global eSIM smartphone connections is expected to reach 1 billion, increasing to 6.9 billion by 2030, which will account for three-quarters of total smartphone connections [1][6] - The eSIM technology is centered around the embedded Universal Integrated Circuit Card (eUICC) chip, which allows for remote SIM configuration and management, enhancing user experience and security [2] Market Dynamics - The demand for eUICC chips is anticipated to grow significantly due to the commercial launch of eSIM services by the three major telecom operators, with the number of domestic eSIM users reaching 3.62 million in 2023, 90% of which are smartwatch users [3] - Domestic companies like Unisoc and Huada Semiconductor are emerging in the eSIM chip design sector, with products widely used in global consumer electronics and IoT devices [2] Supply Chain Opportunities - The etching lead frame, a key material for eSIM chip packaging, has substantial potential for domestic substitution, with the demand for this material expected to rise as eSIM applications accelerate [4] - The WLCSP (Wafer-Level Chip Scale Package) technology is crucial for miniaturizing eSIM chips and is already adopted by major international manufacturers like Apple and Samsung [5] Strategic Positioning - Companies that proactively invest in technology development and establish strong ties with terminal manufacturers and telecom operators are likely to gain competitive advantages in the evolving eSIM industry [6]