智通财经网·2025-10-21 03:42Core Insights - The semiconductor industry is facing significant thermal management challenges as chip sizes shrink and power levels increase, leading to the urgent need for effective heat dissipation solutions [1][2] Group 1: Semiconductor Industry Challenges - The transition towards advanced semiconductor processes (2nm, 1nm, and even sub-nanometer levels) is resulting in increased power density and heat generation, creating "hotspot" issues that can degrade performance and reliability [1] - Ineffective heat dissipation can lead to localized overheating, resulting in performance degradation, hardware damage, and increased costs [1] Group 2: Diamond as a Thermal Management Solution - Diamond is identified as an ideal thermal management material due to its exceptional thermal conductivity of 2000 W/m·K, which is significantly higher than traditional materials like copper and aluminum [2] - The applications of diamond in thermal management include diamond substrates, heat sinks, and diamond structures with microchannels, which cater to the cooling needs of semiconductor devices and server GPUs [2] Group 3: Advantages of Diamond as a Semiconductor Substrate - Diamond offers the highest thermal conductivity among known materials, making it effective for heat dissipation in high power density devices [3] - With a bandgap of approximately 5.5 eV, diamond can operate stably in high-temperature and high-voltage environments, making it suitable for high-power electronic devices [3] - Diamond's electrical current carrying capacity far exceeds that of traditional semiconductor materials, allowing it to accommodate high current applications [3] - The mechanical strength and wear resistance of diamond enhance the reliability and lifespan of devices under harsh operating conditions [3] - Diamond's radiation resistance makes it suitable for use in high-radiation environments such as space and nuclear applications [3]