传长鑫存储计划最快于2026年一季度在上海进行IPO 计划筹资200亿至400亿元人民币

Core Viewpoint - Changxin Storage, a leading Chinese memory chip manufacturer, plans to conduct its initial public offering (IPO) in Shanghai as early as the first quarter of next year, with a target valuation of up to 300 billion RMB [1] Group 1: IPO Plans - The company aims to raise between 20 billion to 40 billion RMB through the IPO, with a prospectus expected to be disclosed to investors as early as November [1] - The IPO is anticipated to attract strong demand from domestic investors [1] Group 2: Production and Technology - Changxin Storage is constructing an HBM (High Bandwidth Memory) backend packaging plant in Shanghai, with production expected to commence by the end of next year [1] - Initial monthly production of HBM wafers is projected to reach approximately 30,000 pieces, which is slightly less than one-fifth of South Korea's SK Hynix's output [1] - The company aims to start mass production of the fourth generation high bandwidth memory (HBM3) chips by 2026 [1] Group 3: Company Background - Changxin Storage was established in 2016 and is the strategic pioneer for China in the global DRAM (Dynamic Random Access Memory) market, which has been dominated by companies from Japan, South Korea, and the United States [1] - In July of this year, the parent company, Changxin Technology, submitted its IPO guidance report and appointed China International Capital Corporation and CITIC Securities as advisory firms [1]