天域半导体通过聆讯:前5个月营收同比降14%华为与比亚迪是股东
Xin Lang Cai Jing·2025-10-21 22:39

Core Viewpoint - Tianyu Semiconductor is preparing for an IPO on the Hong Kong Stock Exchange after passing the listing hearing [2]. Financial Performance - Tianyu Semiconductor reported revenues of 437 million yuan in 2022, 1.171 billion yuan in 2023, and projected 519 million yuan in 2024, indicating a significant decline of 55.6% in 2024 compared to the previous year [4][8]. - The company experienced a net loss of 500 million yuan in 2024, following a profit of 281,000 yuan in 2022 and 95.88 million yuan in 2023 [7][10]. - For the first five months of 2025, the company generated revenue of 257 million yuan, a decrease of 13.5% from 297 million yuan in the same period of 2024 [9]. Product and Technology - Tianyu Semiconductor specializes in silicon carbide (SiC) epitaxial wafers and has developed core technologies for producing power devices ranging from 600V to 30,000V [6]. - The company has completed the construction of its Dongguan Ecological Park, which is expected to start mass production of 6-inch and 8-inch SiC epitaxial wafers by the end of 2025 [6]. Shareholder Structure - Major shareholders include Huawei and BYD, with the company's executive director, Li Xiguang, controlling approximately 29.05% of the equity directly and additional stakes through investment vehicles [11][14]. - The combined holdings of Li Xiguang, Ouyang Zhong, and their associated investment entities account for 58.36% of the total issued shares [14]. Funding and Investment - Tianyu Semiconductor has undergone seven rounds of financing prior to its IPO, including a significant 668 million yuan investment in August 2022 and 491 million yuan in December 2022 [11][12].