泰凌微A股募15亿上市2年后再冲港股 连续遭大基金减持

Group 1 - The company, TaiLing Microelectronics (688591.SH), has announced plans to issue H-shares and list on the Hong Kong Stock Exchange to enhance its global development strategy and brand influence [1] - The company is currently discussing specific details of the H-share listing with relevant intermediaries, and the actual implementation is subject to approval from various regulatory bodies [1] - The H-share listing is expected to optimize the company's capital structure and broaden financing channels, although there is significant uncertainty regarding its approval and execution [1] Group 2 - The National Integrated Circuit Fund plans to reduce its stake in TaiLing Microelectronics by up to 4.8149 million shares, representing 2% of the total share capital, between November 13, 2025, and February 12, 2026 [2] - As of October 22, 2023, the fund initially held 21.4884 million shares, or 8.95% of the total, and has already reduced its holdings by 4.8 million shares, realizing approximately 18.5 million yuan [2][3] - The company has also announced a plan to acquire 100% of Shanghai Panqi Microelectronics Co., with projected revenues and net profits showing a decline over the past three years [3] Group 3 - TaiLing Microelectronics was listed on the Shanghai Stock Exchange's Sci-Tech Innovation Board on August 25, 2023, with an initial public offering of 60 million shares at a price of 24.98 yuan per share [4] - The total amount raised from the IPO was approximately 149.88 million yuan, with a net amount of 135.81 million yuan after deducting issuance costs, exceeding the initial plan by 3.45 million yuan [5] - The funds raised are intended for various technology upgrade projects and research and development initiatives [5][6]