Core Insights - The liquid cooling connector is a critical component in liquid cooling systems, enabling safe and efficient heat management in high-power density scenarios, effectively overcoming the limitations of traditional air cooling [1][2][3] - The Chinese liquid cooling connector market is projected to grow from 1.8 billion yuan in 2021 to 5.011 billion yuan in 2024, with a compound annual growth rate (CAGR) of 40.6%, and is expected to reach 6.5 billion yuan by 2025 [1][10][11] - The industry is driven by increasing demand from data centers, energy storage systems, and electric vehicles, with AI computing and high-power servers being the core growth drivers [1][8][10] Industry Overview - Liquid cooling connectors ensure the efficient and safe transmission of cooling media, such as deionized water and glycol solutions, between devices [2] - The connectors must possess high thermal efficiency, gas tightness (leakage ≤ 0.02ml), pressure resistance (3-5 MPa), shock resistance (20G), and corrosion resistance [3] Market Dynamics - The Chinese liquid cooling connector market is expected to see a significant increase in demand due to policies supporting high-quality development in computing infrastructure and energy efficiency [1][7] - The market structure is dominated by data centers, which are projected to account for approximately 60% of the market share by 2024, followed by energy storage systems at around 20% [8][10] Competitive Landscape - The market is highly concentrated, with the top five companies holding over 70% of the market share. Leading companies include Staubli and Parker in the high-end market, while domestic players like AVIC Optoelectronics and Zhengbei Connection are prominent in the mid-tier market [11][12] - Domestic companies are accelerating the localization process, leveraging cost advantages and technological breakthroughs to enhance market competitiveness [12] Development Trends - The industry is evolving towards smart integration, standard collaboration, and scenario customization, with products transitioning from basic connectors to intelligent nodes that monitor system status in real-time [13][14] - Standardization and compatibility are becoming core development directions to address long-standing issues of interface incompatibility [15] - The diverse needs of downstream applications are driving the customization of materials and processes, with a focus on innovative solutions tailored to specific operational environments [16]