Chan Ye Xin Xi Wang·2025-10-28 01:12Core Insights - The semiconductor sputtering target market in China is experiencing rapid growth, with the market size projected to increase from 1.4 billion yuan in 2017 to 2.6 billion yuan in 2024, reflecting a compound annual growth rate (CAGR) of 9.25% [1][9] - The market is expected to reach 3.3 billion yuan by 2026, driven by the expansion of domestic wafer manufacturing capacity, advancements in process technology, and the deepening application of third-generation semiconductor materials [1][9] - The global semiconductor sputtering target market is also expanding, with a projected growth from $4.688 billion in 2018 to $6.269 billion in 2024, and the market size expected to reach $3.26 billion by 2030, with a CAGR of 7.62% [7][8] Industry Overview - Semiconductor sputtering targets are high-purity materials used in the manufacturing of semiconductor chips, essential for physical vapor deposition processes [2] - The industry is characterized by a significant growth potential despite its relatively late start in China, with a focus on domestic production and import substitution [9] Market Structure - The semiconductor sputtering target industry chain includes raw material supply, target preparation, and application, with upstream involving the production of high-purity metals and ceramics [5] - The downstream applications primarily focus on wafer manufacturing and chip packaging, with wafer manufacturing accounting for approximately 61.8% of the market share [8] Competitive Landscape - The global market is dominated by a few international giants such as JX Metals and Honeywell, while domestic companies like Zhongguang Optical and Longhua Technology are gaining traction [10][11] - The competitive structure is tiered, with leading companies holding significant market shares and smaller firms focusing on niche markets [10] Development Trends - The industry is expected to shift towards high-end, refined products, with increasing demands for purity and uniformity in materials as chip manufacturing advances to smaller nodes [13] - Innovations in product types are anticipated, particularly in response to the needs of third-generation semiconductors and emerging storage technologies [14] - The integration of smart manufacturing and green production techniques is projected to enhance efficiency and sustainability in the sputtering target manufacturing process [16]