锦富技术斩获液冷板订单 已用于英伟达B200芯片液冷散热系统

Core Viewpoint - Jinfu Technology has secured an order for a custom-developed liquid cooling plate architecture, which will be used in the cooling system for NVIDIA's B200 chip, showcasing its technological advancement and market competitiveness [1] Group 1: Product Development - The custom-developed cooling architecture features a thickness of 0.08 millimeters and utilizes the latest MLCP (Microchannel Liquid Cooling Plate) technology, providing a significant first-mover advantage [1] - The cooling solution effectively addresses the TDP thermal effects of processors with power consumption ranging from 1800W to 2000W and above, ensuring stable low-temperature operation of the processor module [1] Group 2: Client Feedback and Future Plans - Feedback from the Taiwanese client indicates that the new cooling architecture has performed well, leading to the completion of multiple rounds of sample testing for the next-generation B300 chip adaptation [1] - The company is now entering the production preparation phase for the B300 chip cooling solution, indicating a positive outlook for future orders and product development [1]