锦富技术获液冷板订单 已用于B200芯片液冷散热系统

Core Viewpoint - Jinfu Technology has received an order from a Taiwanese client for its custom-developed 0.08mm blade heat dissipation structure, which is utilized in the liquid cooling system for the B200 chip [1] Group 1: Product Development - The heat dissipation structure employs the latest MLCP (Microchannel Liquid Cooling Plate) technology, providing significant first-mover advantages and technical superiority [1] - This technology effectively addresses the TDP thermal effects of processors with power consumption between 1800W and 2000W and above, ensuring stable low-temperature operation of processor modules [1] Group 2: Future Prospects - The adaptation plan for the next-generation B300 chip has completed multiple rounds of sample testing, receiving positive feedback and is now entering the production preparation phase [1]