Globenewswireยท2025-10-28 10:15Core Insights - onsemi's Treo platform has been selected by Teledyne Technologies to develop next-generation readout integrated circuit (ROIC) ASICs for infrared imaging systems, highlighting its advanced capabilities in the aerospace, defense, security, and scientific sectors [1][4] Company Overview - onsemi is focused on driving disruptive innovations in automotive and industrial markets, addressing megatrends such as vehicle electrification, sustainable energy, industrial automation, and 5G infrastructure [7] Product Features - The Treo platform is built on a 65nm node with a modular architecture and a comprehensive set of IP building blocks, which accelerates development and reduces time-to-market [2] - Key features of the Treo platform include higher gate density for improved functionality in a smaller footprint, lower power dissipation for enhanced efficiency, and dense on-chip energy storage for better signal integrity [8] - The platform also offers low resistivity substrates for resilience against radiation, a wide temperature range for consistent performance, and die stitching to support large-format sensor designs [8] Strategic Importance - The manufacturing of the Treo platform takes place at onsemi's East Fishkill, NY facility, which holds Category 1A Trusted Supplier accreditation, positioning the company to meet U.S. government needs for domestic chip manufacturing in support of national security [6]