锦富技术获液冷板订单 前三季度营收增长27.78%

Core Insights - Company has received an order for a custom-developed 0.08mm blade cooling structure from a Taiwanese client, which is now used in the liquid cooling system for the B200 chip [1] - The new cooling structure utilizes the latest MLCP technology, providing a significant competitive edge and effectively addressing the TDP thermal issues for processors with power consumption of 1800W to 2000W and above [1] - The company has completed multiple rounds of sample testing for the next-generation B300 chip adaptation plan, receiving positive feedback and is now entering the production preparation phase [1] Industry Trends - The demand for GPU performance is increasing due to the rapid development and application of AI technology, leading to the evolution of GPU products from B200 to the new B300 generation, both based on the Blackwell architecture [1] - The GB200 and GB300 represent the core development direction for data center computing power, with significant increases in chip power and performance making thermal management a critical bottleneck [1] Financial Performance - For the first three quarters of 2025, the company reported a revenue of 1.594 billion yuan, reflecting a year-on-year growth of 27.78% [2] - The revenue for the third quarter also stood at 1.594 billion yuan, maintaining the same year-on-year growth rate of 27.78% [2] Future Plans - The company aims to deepen technical collaboration with leading global GPU companies and their ODM partners, ensuring reliable verification of the liquid cooling plate production process before the large-scale shipment of GB300 [2] - There will be increased investment in the research and development of microchannel cooling plate architecture and manufacturing processes to achieve breakthroughs in cooling efficiency for higher power consumption chips [2]