Core Viewpoint - Jing Sheng Mechanical and Electrical announced the successful delivery of its self-developed 12-inch atmospheric silicon epitaxy equipment to leading domestic customers, achieving international advanced levels in key performance indicators such as resistivity, thickness uniformity, epitaxial layer defect density, production efficiency, and process repeatability [1] Group 1: Product Development and Delivery - The company is actively promoting customer validation for new products including the 12-inch dry-in-dry-out edge grinding machine and the 12-inch double-sided thinning machine [1] - The 12-inch silicon reduced pressure epitaxy growth equipment has successfully achieved sales, utilizing a single temperature zone and multi-temperature zone closed-loop control mode, combined with multi-vacuum zone precise pressure control technology to ensure high stability during the epitaxy growth process [1] Group 2: Technological Advancements - The unique flat cavity structure and multi-port diversion system design of the equipment significantly enhance the film thickness uniformity and doping uniformity of the epitaxial layer, meeting the high standards required for advanced processes [1] - The company has successfully developed ultra-fast ultraviolet laser grooving equipment for advanced packaging applications, filling a gap in the domestic high-end ultraviolet laser grooving technology field and achieving domestic substitution [1]
晶盛机电：公司自主研发的12英寸常压硅外延设备顺利交付国内头部客户