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从提供保护到创造价值 AI开启半导体封测新格局
Shang Hai Zheng Quan Bao·2025-10-29 17:57

Core Insights - The global advanced packaging market is projected to reach $56.9 billion in 2025, with a year-on-year growth of 9.6%, and is expected to grow to $78.6 billion by 2028, reflecting a compound annual growth rate (CAGR) of 10.05% from 2022 to 2028 [3]. Industry Transformation - The logic of semiconductor packaging has shifted from merely providing protective casings to creating economic value, indicating a significant change in the industry dynamics [1][2]. - Advanced packaging is becoming a strategic focal point in the semiconductor supply chain, driven by the demand for AI and high-performance computing [2]. Market Dynamics - The demand for advanced packaging is largely fueled by AI applications, which have significantly increased the need for computing chips [2]. - The advanced packaging sales are expected to surpass traditional packaging for the first time in 2025, with consumer electronics and automotive electronics accounting for 85% of this market [2]. Innovation Directions - The industry is witnessing a surge in new technologies and materials, such as Chiplet technology, CoWoS packaging, and advanced substrates like silicon carbide and glass substrates [4]. - Key challenges in advanced packaging include efficient thermal management, heterogeneous integration of Chiplets, and the need for finer line widths and larger package sizes [5]. Equipment and Material Trends - The global advanced packaging equipment market is expected to reach $30 billion by 2030, with significant investments in hybrid bonding equipment and TSV etching machines [5]. - Glass substrates are emerging as a superior packaging material due to their better electrical and thermal performance, although they face challenges in production and reliability [5]. Strategic Development - The industry requires a collaborative ecosystem that integrates large, medium, and small enterprises to achieve high-quality development and innovation breakthroughs [6]. - There is a need for China to enhance its international influence by developing local standards and actively participating in global standard-setting to secure competitive advantages [6].