红板科技上交所IPO通过上市委会议 专注于印制电路板的研发、生产和销售

Core Viewpoint - Hongban Technology Co., Ltd. is set to raise 2.057 billion RMB through its IPO on the Shanghai Stock Exchange, focusing on the R&D, production, and sales of printed circuit boards, particularly in the mid-to-high-end application market [1] Group 1: Company Overview - Hongban Technology specializes in high-precision, high-density, and high-reliability printed circuit boards, with a significant market share in HDI boards and the ability to mass-produce various interconnect HDI boards and IC substrates [1] - The company's product range includes HDI boards, rigid boards, flexible boards, rigid-flex boards, substrate-like boards, and IC substrates, which are widely used in consumer electronics, automotive electronics, high-end displays, and communication electronics [1] - The company holds a high market share in mobile phone HDI boards and battery boards, supplying 154 million mobile phone HDI boards and 228 million flexible and rigid-flex battery boards to the top ten global mobile phone brands in 2024 [1] Group 2: Financial Information - Projected revenues for Hongban Technology are approximately 2.205 billion RMB, 2.34 billion RMB, 2.702 billion RMB, and 1.71 billion RMB for the years 2022, 2023, 2024, and the first half of 2025, respectively [2] - The net profits for the same periods are estimated to be around 141 million RMB, 105 million RMB, 214 million RMB, and 240 million RMB [2] Group 3: Fundraising and Investment Projects - The funds raised from the IPO will be allocated to projects including the annual production of 1.2 million square meters of high-precision circuit boards, with a total investment of approximately 219.24 million RMB [2] - The project has received the necessary approvals and environmental assessments for implementation [2]