【IPO一线】高端封测第一梯队芯德半导体递表港交所：成立仅5年，小米/OPPO为股东

Company Overview - Jiangsu Xinde Semiconductor Technology Co., Ltd. has submitted its listing application to the Hong Kong Stock Exchange, with Huatai International as the exclusive sponsor, marking its entry into the capital market [2] Fundraising Purpose - The funds raised from the listing will be primarily allocated to two areas: building production bases and new production lines to expand capacity and enhance manufacturing capabilities, and focusing on advanced packaging technology research and development, particularly around the CAPiC platform to strengthen the company's technical competitiveness in the semiconductor packaging and testing industry [4] R&D Investment and Achievements - The company has significantly increased its R&D investment, with expenditures of 58.706 million yuan, 76.623 million yuan, and 93.764 million yuan from 2022 to 2024, and 44.375 million yuan in the first half of 2025. It has accumulated over 200 patents, including 32 invention patents and 179 utility model patents, covering key areas such as packaging structures, methods, equipment, and testing systems [5] - Revenue has grown rapidly, from 269 million yuan in 2022 to 827 million yuan in 2024, with a compound annual growth rate exceeding 40%. The gross loss rate has improved from 79.8% in 2022 to 20.1% in 2024, and the adjusted net profit has turned from a loss of 154 million yuan in 2022 to a profit of 59.77 million yuan in 2024 [5] Future Development Strategy - The company aims to focus on revenue growth, operational efficiency, and cash flow improvement by deepening cooperation with existing clients, expanding new customer resources, and advancing capacity expansion to seize opportunities in advanced packaging demand. It will also continue to iterate on core technologies such as 2.5D/3D and Fan-out to optimize product and order structures [6] Industry Growth Potential - The semiconductor packaging and testing market is projected to grow from 495.6 billion yuan in 2020 to 649.4 billion yuan in 2024, with a compound annual growth rate of 7.0%. The Chinese market is expected to reach 248.1 billion yuan in 2024, with a compound annual growth rate of 9.1%, significantly higher than the global average [6] Capacity Expansion Initiatives - The company has initiated a 5.5 billion yuan advanced packaging base project in Nanjing, with the first phase involving an investment of 1 billion yuan to construct a modern factory covering 153,000 square meters and to establish two leading high-end packaging production lines [7] - The Nanjing base is expected to produce 18,000 units of 2.5D packaging products and 300 million wafer-level high-density chip packaging products annually upon reaching full capacity [7] Financial Position - The company has accumulated over 2 billion yuan in financing over the past five years, attracting investments from notable institutions such as Xiaomi Yangtze River Industry Fund and OPPO. As of the end of the first half of 2025, the company had cash reserves of 149 million yuan, which will be further bolstered by the upcoming listing [7]