Core Viewpoint - Jiangsu Xinde Semiconductor Technology Co., Ltd. has submitted its listing application to the Hong Kong Stock Exchange, marking its entry into the capital market, focusing on the semiconductor packaging and testing sector [1] Group 1: Funding and Investment - The funds raised will be used to build production bases, establish new production lines, and purchase related equipment to enhance manufacturing capacity and meet growing market demand [1] - The company has completed over 2 billion yuan in financing over the past five years, attracting several well-known institutions, including Xiaomi Yangtze River Industry Fund and OPPO [5] Group 2: Technological Innovation - Xinde Semiconductor has developed the "Chip and Advanced Packaging Technology Platform (CAPiC)," integrating high-end packaging technologies such as Bumping, WLP, and 2.5D/3D [2] - The company has invested significantly in R&D, with expenditures of 58.706 million yuan in 2022, 76.623 million yuan in 2023, and projected 93.764 million yuan in 2024 [2] Group 3: Financial Performance - The company's revenue has grown rapidly from 269 million yuan in 2022 to 827 million yuan in 2024, with a compound annual growth rate exceeding 40% [2] - Adjusted net profit has turned positive, moving from a loss of 154 million yuan in 2022 to a profit of 59.977 million yuan in 2024 [3] Group 4: Market Demand and Expansion - The global semiconductor packaging and testing market is projected to grow from 495.6 billion yuan in 2020 to 649.4 billion yuan in 2024, with a compound annual growth rate of 7.0% [4] - The company is expanding its production capacity with a new AI advanced packaging base project in Nanjing, which has a total investment of 5.5 billion yuan [4]
芯德半导体递表港交所 超20亿元资本加持抢占封测话语权
Zheng Quan Ri Bao Wang·2025-10-31 14:11