红板科技IPO过会 募资投向高精密电路板项目

Core Viewpoint - Jiangxi Hongban Technology Co., Ltd. has successfully passed the IPO review by the Shanghai Stock Exchange, focusing on the research, production, and sales of printed circuit boards (PCBs) with a strong market position in high-end applications [1][2]. Group 1: Company Overview - Hongban Technology specializes in the R&D, production, and sales of printed circuit boards, particularly in the high-precision, high-density, and high-reliability segments [1]. - The company has established a comprehensive product structure and possesses extensive technical R&D and production capabilities, offering diverse product choices and one-stop services to clients [1]. - Its products are widely used in consumer electronics, automotive electronics, high-end displays, and communication electronics, with significant competitive advantages in the consumer and automotive electronics sectors [1]. Group 2: Market Position and Performance - In the mobile HDI mainboard and battery board sectors, Hongban Technology has a substantial market share, supplying 154 million mobile HDI mainboards and 228 million flexible and rigid-flex battery boards to the top ten global smartphone brands in 2024 [2]. - The company's mobile HDI mainboard supply accounts for approximately 13% of the total shipments of the top ten smartphone brands, while its battery board supply represents about 20% [2]. - Hongban Technology ranks 35th in the 2024 China PCB industry comprehensive top 100 enterprises and 58th in the 2024 global top 100 PCB companies according to Prismark [2]. Group 3: Financial Performance - From 2022 to the first half of 2025, Hongban Technology's revenue figures were 2.205 billion, 2.34 billion, 2.702 billion, and 1.71 billion yuan, respectively, with net profits of 120 million, 87.038 million, 194 million, and 233 million yuan [3]. - The company has shown a growth trend in both revenue and profit, establishing a certain market scale and position [3]. - The IPO aims to raise 2.057 billion yuan to invest in a project for producing 1.2 million square meters of high-precision circuit boards annually, enhancing its HDI board production capacity and optimizing its financial structure [3].