AI需求强劲 PCB、被动元件价同步上扬

Group 1 - Strong demand for AI is driving price increases in the semiconductor supply chain, particularly affecting passive components and copper foil substrates [1] - The PCB supply chain has experienced a supply-demand imbalance since the second half of this year, exacerbated by NVIDIA's significant resource absorption [1] - High demand for T-Glass fiberglass is leading to severe shortages in Q4, while copper foil substrates are expected to see a supply gap due to necessary upgrades in signal integrity standards [1] Group 2 - Goldman Sachs predicts that prices for non-NVIDIA ABF substrates will increase by 5% to 10% each quarter from Q4 2023 to Q4 2026, with BT substrates also experiencing significant price hikes [1] - The passive component industry may face tightening supply conditions by 2026, prompting major Taiwanese passive component manufacturers like Yageo to raise tantalum capacitor prices starting in November [1]