Zhong Guo Jing Ji Wang·2025-11-02 08:00Core Viewpoint - The company plans to raise up to 347.5 million yuan through a private placement of A-shares to specific investors, aimed at expanding its RF chip manufacturing capacity and supplementing working capital [3][4]. Summary by Sections Fundraising Details - The total amount to be raised is capped at 347,500,000 yuan, which will be used for RF chip manufacturing expansion and working capital [3]. - The issuance will involve no more than 35 qualified investors, including various financial institutions and qualified foreign institutional investors [3]. - The pricing benchmark for the issuance will be set on the first day of the issuance period, with the issue price not lower than 80% of the average trading price over the previous 20 trading days [3]. Issuance Quantity - The number of shares to be issued will be determined by dividing the total fundraising amount by the issue price, with a maximum limit of 30% of the company's total share capital prior to the issuance [4]. - Based on current calculations, the maximum number of shares to be issued is approximately 160,482,959 shares [4]. Shareholder Structure - Shares issued in this round will be restricted from transfer for six months post-issuance [5]. - As of June 30, 2025, the company's total share capital is 53,485,890 shares, with the actual controller holding 32.40% of the shares [5]. - If the maximum number of shares is issued, the total share capital will increase to 69,542,620 shares, with the actual controller's shareholding reducing to 24.54%, ensuring no change in control [5]. Sponsorship - The lead underwriter for this issuance is China International Capital Corporation, with representatives Zhang Linji and Cao Jun [6].