天图投资(01973)获准发行本金总额不超过3亿元的科技创新债券

Core Viewpoint - TianTu Investment (01973) has received a notification from the China Interbank Market Dealers Association regarding the acceptance of its registration for the issuance of technology innovation bonds, allowing the company to issue bonds totaling up to RMB 300 million [1] Group 1 - The company can issue technology innovation bonds with a total principal amount not exceeding RMB 300 million [1] - The effective period for the issuance of these bonds is up to two years from the date of the acceptance notification [1] - Guotai Junan Securities Co., Ltd. will act as the lead underwriter for the bond issuance, which will occur in batches during the effective period [1]