Flex(US:FLEX) Prnewswireยท2025-11-04 00:00Core Viewpoint - Flex and LG Electronics have formed a partnership to develop integrated, modular cooling solutions aimed at addressing the thermal management challenges faced by AI-era data centers [2][4]. Group 1: Partnership Details - The collaboration will leverage Flex's liquid cooling portfolio and power products alongside LG's high-performance air and liquid cooling modules, including CRAC, CRAH, chillers, and coolant distribution units (CDUs) [4][8]. - The partnership aims to provide data center operators with customizable solutions that can scale with demand, enhancing efficiency and deployment speed [5][6]. Group 2: Technological Advancements - Advanced cooling technologies are essential for efficient heat dissipation in high-density data centers, which are increasingly necessary due to the rise of AI workloads [4][8]. - The integrated solutions will ensure reliable temperature control, maximize energy efficiency, and facilitate rapid deployment of high-density AI workloads [5][6]. Group 3: Market Positioning - This partnership is part of Flex's strategy to enhance its competitiveness in the AI data center market by collaborating with leading global companies [6]. - The co-developed solutions will be included in the Flex AI infrastructure platform, which integrates power, cooling, compute, and services into modular designs [6][8].