Core Insights - The "Hong Kong FinTech Week 2025" took place from November 3 to 4, attracting over 700 exhibitors, 800 speakers, and 37,000 attendees, highlighting its status as a leading fintech event in Asia [1] - Zhejiang Hengfeng International Holdings Limited showcased its two listed companies, Fopay and Hengfeng Technology Innovation, focusing on cross-border digital payments and on-chain asset management infrastructure [1][2] Group 1: Fopay's Presentation - Fopay's theme was "Cross-border without boundaries, instant payment - Accelerating the free flow of digital assets," featuring an immersive cross-border remittance experience area that drew significant attendee interest [1] - The experience area quickly became popular, with long queues forming as participants were eager to try Fopay's newly launched high-speed cross-border remittance feature [1] Group 2: Hengfeng Technology Innovation's Focus - Hengfeng Technology Innovation's exhibition centered on "Connecting all things, building a new future of wealth," targeting institutional investors and corporate clients with its on-chain asset management concepts [2] - The CEO indicated efforts to combine traditional asset allocation models with blockchain technology to provide compliant and transparent on-chain fund solutions for institutional clients [2] Group 3: Strategic Collaboration - Hengfeng International's strategic leader emphasized the synergy between Fopay and Hengfeng Technology Innovation, proposing a "payment + asset management" dual-engine solution [2] - Fopay focuses on creating compliant and low-friction channels for cross-border payments, while Hengfeng Technology Innovation explores feasible paths for on-chain asset management, collectively providing practical cases for digital finance within a compliance framework [2]
恒峰国际“双星”亮相香港金融科技周