恒坤新材：构筑核心竞争力 力争成为集成电路关键材料领域国际先进企业

Core Viewpoint - Xiamen Hengkang New Materials Technology Co., Ltd. is focused on the research and industrial application of key materials for integrated circuits, aiming to break the foreign monopoly in the 12-inch integrated circuit wafer manufacturing sector and enhance domestic supply chain security [6][18]. Company Overview - The company specializes in the research, production, and sales of photolithography materials and precursor materials, being one of the few domestic firms capable of developing and mass-producing key materials for 12-inch integrated circuit wafers [6][7]. - Its products are essential for the manufacturing processes of advanced NAND, DRAM storage chips, and logic chips at 90nm technology nodes and below [7]. Product Development - The company has successfully mass-produced products including SOC, BARC, i-Line photoresists, KrF photoresists, and TEOS precursor materials, with ongoing development of new products like ArF photoresists and SiARC [7][13]. - As of the reporting period, the company has over a hundred products in various stages of research, validation, and mass supply [7]. Financial Performance - The company's main business revenue has shown steady growth, with self-produced product sales revenue increasing from 123.58 million yuan in 2022 to 344.19 million yuan in 2024, reflecting a compound annual growth rate of 66.89% [13][15]. - The gross profit from the main business has also increased, with self-produced products contributing significantly to the overall gross profit [14][15]. R&D Investment - R&D expenses have been consistently increasing, amounting to 42.74 million yuan in 2022 and 88.61 million yuan in 2024, representing 16.17% of the revenue [16]. - The company emphasizes continuous innovation and product development to enhance its market position [21]. Market Position and Strategy - The company aims to fill the gap in high-end materials currently dominated by foreign manufacturers, with a focus on expanding its product line and improving product quality [19][20]. - It plans to leverage its capital market entry to enhance technological development and industrial layout, aiming to become a leading domestic and internationally competitive enterprise in the integrated circuit key materials sector [24][20]. Listing and Fundraising - The company is set to raise funds through its IPO to invest in projects related to advanced materials and precursor materials for integrated circuits, which will enhance its product offerings and competitive edge [29][30]. - The expected market capitalization post-IPO is projected to be no less than 1 billion yuan, meeting the listing standards [26].